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| LVD SCSI Terminator Technical Data Sheet RoHS Compliant Parts Available Description This LVD SCSI termination network is designed for high performance active termination of SCSI networks compliant to SPI-2 (Ultra2), SPI-3 (Ultra3) and beyond. Designed with a ceramic substrate and a ball grid array interconnect, this device virtually eliminates channel capacitance and lead inductance, the primary cause of reduced system performance. BGA packaging has been proven to reduce rework and improve reliability. Features * * * * * * * 9 Line LVD Termination Network Ultra2 and Ultra3 Compliant Low Channel Capacitance Less than 0.25pF BGA package reliability 1% Resistor Tolerance Low Channel Cross Talk RoHS Compliant Designs Available * Compatible with both lead and lead-free manufacturing processes Style E 4 3 Schematic Diagram R1 R2 Electrical Specifications Resistor Tolerance: TCR Operating Temperature Range Maximum Resistor Power: Maximum Package Power: Process Requirements: Maximum Re-flow Temperature 1.0% 200ppm/C -55C to +125C 0.05 Watts at 70C 1.0 Watts at 70C Per IPC/JEDEC J-STD-020C 2 R1 1 A B C D E F G H J LVD SCSI Active Termination Circuit 1.3V DIFSENS 2.7V to 5.25 V TERMPWR 2 4.7F UCC561 4 3 4.7F 0.75 V 7 6 4.7F 1.75 V R1 R2 R1 RT1300B6 RT1300B6 RT1300B6 LVD SCSI Bus Ordering Information Standard Part No. R1 R2 Lines Pitch (mm) RoHS Part No. Packaging Information Suffix Tape Width Carrier Pitch Reel Diameter Parts/Reel Part Number Coding 7 inch reel, Add TR7 to part number, example RT2300B6TR7 13 inch reel, Add TR13 to part number, example RT2300B6TR13 (Bulk packaging is not available) TR7 24 mm 8 mm 7 inch 1,000 TR13 24mm 8 mm 13 inch 4,000 RT1300B6* 475 121 9 1.27 RT2300B6* *Indicates available Top Probe-able part numbers. Refer to the following link for detailed Top Side Probe-able information: www.ctscorp.com/components/clearone/TopProveClearOne.pdf Direction of Fee d CTS Electronic Components www.ctscorp.com (c) 2006 CTS Corporation. All rights reserved. Information subject to change. Page 1 LVD SCSI Terminator March 06 Recommended Land Pattern Outline of Substrate PCB Pad Diameter 1.27 mm Pitch (B6) = 0.64mm/.025 inch Solder Mask Dia = Pad Diameter +.15mm (.006 inch) For .006" Thick Solder Paste Stencil, Aperture Opening Should be Equal to the PCB Pad Diameter. Refer to www.ctscorp.com/components/clearone.asp for additional PCB design information Mechanical Diagram L H W RT_300B6 CTS YRWK P (Pitch) A1 Identifier K P (Pitch) D 1.27mm Pitch RT1300B6 RT2300B6 mm Inch L 11.430.15 .450.006 W 5.080.15 .200.006 H 1.320.15 .052.006 P 1.270.25 .050.010 D 0.760.05 .030.002 K 0.640.25 .025.010 Complete ClearONE Product, Processing, and Application Information can be found at the following link: http://www.ctscorp.com/components/clearone.asp CTS Electronic Components www.ctscorp.com (c) 2006 CTS Corporation. All rights reserved. Information subject to change. Page 2 LVD SCSI Terminator March 06 |
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